Jinli Technology

Committed to becoming a core switch service provider

Typical cases

JL3290G8 - Air-cooled

Air-cooled model: JL3290-M8-A0-R0-00

Product Introduction

The JL3290G8 is Inspur Information’s new-generation 2U single-socket/dual-single-socket universal server. It is a pioneering product that brings the “Open Computing Module” standard to practical application, setting an industry benchmark. The server supports Intel® Xeon® 6 processors and the 5th-generation AMD EPYC™ 9005 series processors. The entire system features full decoupling, allowing compute modules, management modules, and storage modules to be replaced on demand and upgraded asynchronously. Ideal for use in container cloud and big data applications, this server delivers powerful computing performance while reducing the blast radius and enhancing system stability for users.

Product Features

Streamlined design, safe and reliable.

Delay optimization for quick response

High fault tolerance and strong controllability

Full decoupling, flexible scalability

The motherboard system features fewer components: this reduces potential failure points and enhances the motherboard's reliability.

Simple wiring: This helps maintain signal integrity and ensures that data can be transmitted accurately and quickly.

Optimal thermal pathways: Enhance heat dissipation efficiency and reduce the difficulty of heat management. Minimize adverse effects such as parasitic capacitance and inductance, thereby improving the electrical performance of the motherboard.

Reasonable layout: Reduces interference from power supply noise on other components, minimizes signal transmission delay, and enhances the overall performance of the motherboard.

The single-path architecture eliminates socket-to-socket communication issues, eliminating the need for UPI interconnects and cross-NUMA access, resulting in lower latency. This architecture enhances user experience, improves system efficiency, boosts interactivity, reduces packet loss rates, and supports a greater number of concurrent users.

Single-channel/single-dual-channel system design features a short blast radius, a small impact zone in case of failure, and a brief migration time. This design can reduce the scope of fault impacts, enhance system availability, strengthen fault-tolerance capabilities, limit the effects of security vulnerabilities, and facilitate security management and remediation.

Modular design allows for flexible support of single-channel or dual-single-channel configurations based on different customer requirements. The decoupled chassis offers flexible I/O expansion, making it adaptable to computing, storage, and GPU scenarios.

Technical Specifications

Product Model	Maintenance method	Cooling method
NF3290-M8-A0-R0-00	Late exit	Air-cooled
Product form	Height: 2U; Width: 19 inches; Depth: 850mm (excluding mounting ears) The system can support up to 2 half-width single-path compute nodes and offers the option to configure either a single-path or dual-single-path system.
Processor	1 or 2 Intel® Xeon® 6 processors (SRF-AP/GNR-AP), TDP 500W
Memory	Supports 12 DDR5 6400MHz RDIMMs or 8800MHz MCR DIMMs.
Storage	12-bay configuration: ① Supports 12 x 3.5-inch hard drives and is compatible with 2.5-inch hard drives; optional SAS/SATA/NVMe; supports hot-swapping. ② Design reservation: Supports 12 E3.S 16.8mm / E1.S 15mm hard drives (x4, x8, x16) 24-bay configuration: ① Supports 24 2.5-inch hard drives, with optional SAS/SATA/NVMe support, and supports hot-swapping. ② Design reservation: Supports 32 E1.S 15mm / 16 E3.S 16.8mm hard drives (x4), and supports hot-swappable functionality.
PCIe expansion	Rear 1: ① Supports 6 PCIe 5.0 FH3/4L slots or 4 x 3.5-inch hard drives, with optional SAS/SATA support and hot-swappable capability. ② Supports 4 PCIe 5.0 HHHL slots or 4 x 2.5-inch hard drives, with optional SAS/SATA/NVMe support and hot-swappable capability. ③ Needs to support 1 PCIe 5.0 OCP card. Rear 2: ① Supports 6 PCIe 5.0 FH3/4L slots or 4 x 3.5-inch hard drives, with optional SAS/SATA support and hot-swappable capability. ② Supports 2 PCIe 5.0 FH3/4L slots ③ Needs to support 1 PCIe 5.0 OCP card. Rear 3: Support for 4 x 450W DW FH3/4L GPUs + 1 x 300W DW SMNIC + 1 x PCIe 5.0 FH3/4L card
Power supply	Two hot-swappable 1600W/2000W/2700W/3200W platinum/titanium power supplies, supporting 1+1 redundancy.
Operating temperature	5℃~35℃

Keywords:

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Typical Cases

Zimbabwe National Supercomputing Center Phase 1 and Phase 2 overall construction project

Zimbabwe National Data Center Phase 1 Overall Construction Project, Phase 2 Disaster Recovery Center Overall Construction

Congo (Brazzaville) National Data Center Machine Room and Building Intelligent Construction Project

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